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In this regard, the section discusses maintenance issues that need to find the best maintenance system in order to minimize the amount of damage to the machine and the costs of repair or maintenance of the machine incurred. The wafer packing machine is a wafer processor that produces uploader products. The purpose of this study is to learn how to treat from PT. The top tbk synthesis and how to improve the efficiency of the wafer as well as how to allow proper evaluation to improve the efficiency of the wafer.
The method used is Overall Equipment Effectiveness After conducting research, the average value of Overall Effective Equipment obtained from wafers is 34.00%. These results are still far from world class standards of 85%. It is known that the biggest loss that causes this low OEE value is Reducing speed loss by 143.3% and defect loss by 9.68% of the overall loss. The losses caused by the low consist of engine, human, environmental, and method factors.
Engine and human factors are the most dominant factors. To reduce these losses, the company must provide operator skills and knowledge about the signs of equipment failure. In addition the operator provides additional work consisting of equipment that is often used in work so that the maintenance section can be more focused. Then the company must pay more attention to the comfort of the operator in order to consider and improve the operator to increase more to increase operator awareness of the tools they use.
Keywords : Care Management Evaluation, Overall Equipment Effectiveness, Six Big Losses
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